Sony has accepted the heating issue with the latest flagship Xperia Z3+ and Z4. Only Japanese users are suffering in case of Xperia Z4, but Xperia Z3+ is the global version that features almost same specification. Both the model features Qualcomm’s Snapdragon 810 chipset that has been known as troubled chip that causes the device heating more than its predecessor. So that’s not the Xperia device, but the chipset.
However, Sony admitted the heating issue with Sony Xperia Z3+ and Z4, and said that the device may get heat and also cause to close the certain apps that increasing the heating issue. The heating issue increases more while using graphic apps, like Games and camera. Sony will release the OTA update soon to fix this issue. Snapdragon 810 features Quad-core ARM Cortex A57 and Quad-core A53 with 64-bit support plus Adreno 430 GPU that is meant to run the device faster with better graphic than the previous version of chip. It seems sony will release the update to reduce the heating issue by controlling the performance, that could be one of the downgrade of the device. Well, this can’t be said for sure until Sony releases the update.
There are some more devices in the market with Snapdragon 810 chipset, like Xiaomi Mi Note Pro, HTC One M9 and LG G Flex2. Xiaomi was aware of the issue before launching the device so incorporated 4 graphite cooling fins inside to resolve the heating issue. HTC was also wise enough to test the device before the launch in the market, and resolved the heating issue with OTA update before it went to the market. LG also did a great job with LG G Flex2, and the heating issue was not that much concerned.
Well, Sony was also aware of the issue, but failed to resolve it. If you are not happy with the device performance, visit Sony’s service center to get assistant or you can wait for Sony to release OTA update to resolve the heating issue with Sony Xperia Z3+ and Z4.