Huawe’s Kirin 950 specs was leaked earlier as well, but now we have full specifications exposure of Kirin 950 as well as Kirin 940. These two high-end chipsets will compete Qualcomm’s Snapdragon 820 and Mediatek Helio X20.
Kirin 950 Specifications
Kirin 950 would be based on 16 nm FinFET tech, and would feature an octa-core processor. It’s not a true octa-core SoC, but combination of 2 quad-core, like Exynos 7420. So one of its quad-core processor is based on Cortex-A72 and can reach the maximum clock speed of 2.4 GHz, and another part of quad-core is based on Cortex-A53 and will be clocked at up to 1.5 GHz. It supports 64-bit architecture.
Kirin 950 will be combined with Mali-T880 MP6 GPU, and will feature LTE Cat 10, that can reach the downloading speed of up to 450 Mbps and Uploading speed of up to 100 Mbps. Devices with Kirin 950 would perform far better with LPDDR4 RAM, compared to its predecessor. Along with these features, it would support up to 42 MP camera dual ISP, Bluetooth 4.2, eMMC 5.1, Native 10-bit 4K video encode and Tensilica HiFi 4 DSP.
Kirin 940 Specifications
Kirin 940 is also based on 16 nm FinFET tech and ARMv8-A. Like Kirin 950, it is also an octa-core SoC (Cortex A72 Quad-core 2.2 GHz + Cortex A53 Quad-core 1.5GHz A53). It features Mali-T860 MP4 GPU, LPDDR4 RAM, LTE Cat 7 with up to 300 Mbps downlink and up to 100 Mbps uplink, up to 32 MP Dual ISP camera etc.. It is also based on 64-bit architecture.
Rest of the specifications of Kirin 940 remains the same, eMMC 5.1 faster storage, Bluetooth 4.2 USB 3.0 support, Native 10-bit 4K video encode, UFS 2.0 etc..
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Compared to Qualcomm’s Snapdragon 820, Kirin 950 has more cores and clock speed. Snapdragon 820 features a 2.2 GHz Quad-core processor based on Cortex-A72, but they used 14 nm FinFET tech. Kirin 950 is expected to outperform Snapdragon 820, but may not stand against Mediatek Helio X20 deca-core SoC.